How to Use BGA Reballing Kit for Ball IC Repair in Hindi



BGA Reballing Kit Ko Mobile Repairing Me Use Kaise Kare
how to use BGA Reballing Kit for Ball IC Repair in Mobile Phone Repair. Mobile repairing me Ball Grid IC (BGA) IC ko repair karne ke liye BGA Kit kanuse kiya jata hai. Mobile phone ki PCB circuit board par Ball IC ki identification karna bahut hi aasan hai. Ball IC ko jab hum upar se dekhete hai to aise dikhai deti hai jaise PCB circuit board par chipaki ho lekin ball ic IC ke pende me chhoti chhoti balls bani hoti hai. Aaj ke mobile phone repair lesson me yah bataaya gaya hai ki aap ball ic ko kaise reballing karke repair kar skate hai.


BGA Reballing Kit Kya Hai - What is a BGA Reballing Kit ?
Last kai years se mobile phones ki PCB par ball ic ka ka upyog jyada hone laga hai.Ek complete BGA Kit me Soldering Iron or SMD Rework Station hi nahi hote hai balki kai mobile repairing tools hone jaruri hai jaise
  • Solder Paste
  • Solder Flux
  • PCB Stand Holder
  • Tweezers
  • BGA Soldering Wire
  • BGA Desoldering Wire
  • BGA Reballing Stencil
  • ESD Safe Brush
  • Heat Resistance Kapton Tape
  • Stencil Par PCB Ko Hold Karne Ke Liye Clips

Ye Lesson Jarur Sikhe -

BGA Kit Se Ball IC Repair Karna Sikhe
1. Sabse Pahle Mobile Phone Ko Disassemble or Open Kare.
2. PCB Se Ball IC Ko SMD Rework Station Ko Use Karke Remove Kare.
3. PCB Par Jahan Se IC Ko Remove Kiya Waha Par PCB Ko Clean Kare.
4. Ab Soldering Iron Par Desoldering Wire Lekar Jaha Se IC Ko Remove Kiya Us Place Par Se Bekar Ki Soldering Ka Hatha De.
5. Ab BGA Reballing Stencil Par Balls Ke Aadhar Par IC Ki Correct Size Ko Chune

BGA Kit se ball ic ko repair kaise kare Hindi Me
BGA Kit
6. BGA Rebaling Stencil Par IC Ko Rakhkar Clip or Tap Se Kashkar Hold Kar De.
7. Ab Stencil Ki Dusri Side Se Soldering Paste Lagaaye, Soldering Paste Ko Stencil Ke Chhote Chhote Holes Se IC Par Stick Karaye.
8. Ab SMD Rework Station Se Heat De Taki Soldering Paste Thos Hokar Jam Jaye or IC Par Balls Solder Hokar Chipak Jaye.
9. IPA Isopropyl Alcohol Water Se IC Ko Wash or Clean Karke IC Ko BGA Raballing Stencil Se Hatha De.
10. Ab Ball IC Ko Mobile Phone Ki PCB Par Jahan Se Remove Kiya Wahan Par SMD Rework Station Se Heat Dekar Solder Kar De.   

Ab aap mobile phone ki pcb circuit board par se kisi bhi ball IC ko BGA Reballing Kit se repair kar sakte hai. Mobile repairing course ki new lesson apne mail par receive karne ke liye free email subscription lena na bhule.

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